I learned the following MEMS fabrication concepts: scaling laws, lithography, Mask aligner and imaging optics, resolution in photolithography and mask layout, structure of silicon and properties, oxidation and diffusion, nucleation and growth, evaporation and sputtering, CVD and PECVD, atomic layer deposition, polysilicon, wet etching, surface micromachining, bulk micromachining processes, corner compensation and etch stop, vacuum physics and kinetic theory, plasma and deep RIE etching, characterization methods, PDMS and SU-8 MEMS processing, stereolithography, wafer anodic bonding and local bonding, electroplating metals, MEMS/NEMS sensors, and microcantilever fabrication processes.
With this knowledge, I performed the following experiments in the cleanroom: lab safety and clean room protocol, CAD and mask making, photolithography, etching and bulk micromachining, metal deposition, characterization Methods, BioMEMS device molding, anodic bonding & MEMS packaging.
Here are photos from my MEMS device fabrication process:
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